Senior Electronics Engineer – Carrier Board

RIVR, part of Amazon is a robotics company pioneering Physical AI through real-world doorstep delivery. Founded in 2024 as an ETH Zurich spin-off, RIVR developed wheeled-legged robots designed to operate in complex, unstructured environments such as stairs, gates, doors, and uneven urban terrain. We believe that achieving general physical intelligence requires solving real customer problems in the real world, where robots can learn from rich operational data at scale.
Following our acquisition by Amazon in March 2026, we are continuing this mission with greater reach and speed. By combining custom robot hardware, onboard autonomy, and cloud-based coordination, RIVR, part of Amazon is building the next generation of safe, reliable autonomous robots for last-mile delivery.

Job Description

As a Senior Electronics Engineer – Carrier Board, you will own the design of GPU/SoC carrier boards for our robotic compute platform — from schematic capture through PCB layout, bring-up, and production release. You will integrate high-speed digital interfaces and sensor front-ends into compact, reliable board designs for mobile Physical AI applications. Beyond technical depth, you will manage supplier and partner relationships, define development priorities, and drive sourcing decisions. You are the technical owner of the carrier board, not just a layout executor.

What You’ll Be Doing

• Design and own carrier boards for GPU/SoC compute modules end-to-end: requirements → schematic → layout → bring-up → production release.


• Integrate high-speed digital interfaces such as multi-gigabit Ethernet, DDR4, PCIe, MIPI CSI-2, GMSL SerDes, and USB 3.x.


• Design electrical front-ends for sensors and modules including cameras, LIDARs, RADARs, and wireless connectivity (WiFi/5G).


• Manage supplier and partner relationships: SoC vendors, connector suppliers, contract manufacturers, and module providers.


• Evaluate and select components and suppliers based on cost, availability, quality, and roadmap fit.


• Define and own development milestones and timelines; coordinate across internal teams and external partners.


• Make trade-off decisions (features vs. schedule vs. cost) and communicate them clearly to stakeholders.


• Perform board bring-up, debug, and validation of high-speed interfaces.


• Provide signal integrity guidance for PCB layout (impedance control, length-matching, stackup definition).


• Collaborate closely with firmware, mechanical, and systems engineering teams.

• Master’s degree or higher in Electrical Engineering, Electronics, or a closely related field.


• 5+ years designing carrier boards or motherboards for GPU/SoC compute modules.


• Proven track record integrating high-speed digital interfaces (e.g., DDR4, PCIe, multi-gig Ethernet, GMSL) at board level.


• Experience owning a board design end-to-end from requirements through production release.


• Ideally worked in mobile, edge-compute, or automotive-adjacent applications (robotics, autonomous vehicles, drones, mobile AI platforms).


• Hands-on schematic capture and PCB layout skills (Altium, OrCAD, or equivalent).


• Strong understanding of signal integrity fundamentals.


• Demonstrated ability to manage supplier and partner relationships and drive sourcing decisions.


• Comfortable defining priorities, timelines, and trade-offs for a board development project.


• Strong problem-solving skills and ability to debug high-speed interfaces during bring-up.

• Experience with NVIDIA Jetson, Orin, or Drive platform carrier board design.


• Signal integrity simulation experience (eye-diagram analysis, S-parameter extraction).


• Familiarity with automotive-grade design requirements (temperature range, vibration, component qualification).


• Experience with power delivery design for high-current GPU modules.


• Knowledge of thermal management integration at PCB level.


• EMC/EMI pre-compliance testing experience.


• Exposure to Functional Safety design principles (IEC 61508, ISO 26262).


• Experience in robotics, automotive, aerospace, or consumer electronics sectors.


• PhD degree in a relevant engineering discipline.


• Experience managing a hardware team.

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